Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment.

نویسندگان

  • Yan Xu
  • Chenxi Wang
  • Lixiao Li
  • Nobuhiro Matsumoto
  • Kihoon Jang
  • Yiyang Dong
  • Kazuma Mawatari
  • Tadatomo Suga
  • Takehiko Kitamori
چکیده

A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (~1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ~25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O(2)/CF(4) gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.

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عنوان ژورنال:
  • Lab on a chip

دوره 13 6  شماره 

صفحات  -

تاریخ انتشار 2013